3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements

TL;DR

This paper develops and validates 3D simulation models for bond wire on-chip inductors with different cores, enabling accurate prediction of magnetic effects on circuits through measurements and modeling.

Contribution

It introduces validated 3D simulation models for on-chip inductors with air and ferrite cores, improving design accuracy.

Findings

High agreement between simulation and measurement for air core inductors.

Accurate ferrite core models require precise material characterization.

Models predict magnetic influences on integrated circuits.

Abstract

This paper proposes 3D field simulation models for different designs of integrated bond wire on-chip inductors. To validate the simulation models, prototypes for three designs with air and ferrite cores are manufactured and measured. For air core inductors, high agreement between simulation and measurement is obtained. For ferrite core inductors, accurate models require an exact characterization of the ferrite material. These models enable the prediction of magnetic field influences on underlying integrated circuits.