A thermal bonding method for manufacturing Micromegas detectors
Jianxin Feng, Zhiyong Zhang, Jianbei Liu, Binbin Qi, Anqi Wang, Ming, Shao, Yi Zhou

TL;DR
This paper introduces a simplified thermal bonding method for manufacturing Micromegas detectors, achieving high performance metrics with less complex processing compared to traditional bulk methods.
Contribution
The paper presents a novel thermal bonding technique that simplifies Micromegas detector production without etching, maintaining high performance and enabling new structural designs.
Findings
Energy resolution of ~16% with 5.9 keV X-rays
Detection efficiency >98% with 5 GeV electron beam
Gas gain up to 10^5 with improved uniformity
Abstract
For manufacturing Micromegas detectors, the "bulk" method based on photoetching, was successfully developed and widely used in nuclear and particle physics experiments. However, the complexity of the method requires a considerable number of advanced instruments and processing, limiting the accessibility of this method for production of Micromegas detectors. In view of these limitations with the bulk method, a new method based on thermal bonding technique (TBM) has been developed to manufacture Micromegas detectors in a much simplified and efficient way without etching. This paper describes the TBM in detail and presents performance of the Micromegas detectors built with the TBM. The effectiveness of this method was investigated by testing Micromegas detector prototypes built with the method. Both X-rays and electron beams were used to characterize the prototypes in a gas mixture of…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
