Maximizing the spin-orbit torque efficiency of Pt/Ti multilayers by optimization of the tradeoff between the intrinsic spin Hall conductivity and carrier lifetime

TL;DR

This study optimizes Pt/Ti multilayers to maximize spin Hall ratio by balancing intrinsic spin Hall conductivity and carrier lifetime, achieving high efficiency for spin-orbit torque applications.

Contribution

It demonstrates how Ti insertions can enhance spin Hall ratio in Pt films by managing the tradeoff between conductivity and carrier lifetime, providing a practical design for spintronic devices.

Findings

Achieved a spin Hall ratio of 0.8 in optimized multilayers.

Identified the tradeoff limit between spin Hall conductivity and carrier lifetime.

Demonstrated low resistivity and high efficiency suitable for practical applications.

Abstract

We report a comprehensive study of the maximization of the spin Hall ratio ({\theta}SH) in Pt thin films by the insertion of sub-monolayer layers of Ti to decrease carrier lifetime while minimizing the concurrent reduction in the spin Hall conductivity. We establish that the intrinsic spin Hall conductivity of Pt, while robust against the strain and the moderate interruption of crystal order caused by these insertions, begins to decrease rapidly at high resistivity level because of the shortening carrier lifetime. The unavoidable trade-off between the intrinsic spin Hall conductivity and carrier lifetime sets a practical upper bound of {\theta}SH >=0.8 for heterogeneous materials where the crystalline Pt component is the source of the spin Hall effect and the resistivity is increased by shortening carrier lifetime. This work also establishes a very promising spin-Hall metal of [Pt 0.75 nm/Ti 0.2 nm]7/Pt 0.75 nm for energy-efficient, high-endurance spin-orbit torque technologies (e.g., memories, oscillators, and logic) due to its combination of a giant {\theta}SH of 0.8, or equivalently a dampinglike spin torque efficiency per unit current density of 0.35, with a relatively low resistivity (90 uOhm cm) and high suitability for practical technology integration.