# Dust charging in dynamic ion wakes

## TL;DR

This paper uses molecular dynamics simulations to study how dust grains in plasma acquire charge and interact via ion wakefields, revealing detailed dynamics of dust-ion interactions in flowing plasmas.

## Contribution

It introduces a self-consistent simulation approach to analyze dust charging and wakefield effects in plasma sheaths, advancing understanding of dust-ion interactions.

## Key findings

- Decharging of dust grains in ion wakes mapped across different flow speeds
- Ion wakefield forces can be attractive and influence dust grain arrangements
- Dust charging dynamics are significantly affected by ion flow conditions

## Abstract

Micron-sized dust grains have been successfully employed as non-perturbative probes to measure variations in plasma conditions on small spatial scales, such as those found in plasma sheaths. The dynamics of the grains can be used to map the forces due to electric fields present in the sheath, but the particle charge and electric field are difficult to measure independently. The problem is further complicated by the ion wake field which develops downstream of the dust grains in a flowing plasma. Within a sheath, ions are accelerated towards the charged boundary, and this ion flow creates a positively-charged spatial region downstream of the dust grain, called the ion wake. The ion wake in turn modifies the interaction potential between the charged grains. Here we use a molecular dynamics simulation of ion flow past dust grains to investigate the interaction between the charged dust particles and ions. The charging and dynamics of the grains are coupled self-consistently and derived from the ion-dust interactions, allowing for detailed analysis of the wakefield-mediated interaction as the structural configuration of the dust grains changes. The decharging of a dust grain as it moves through the wake of an upstream particle and the attractive ion wakefield force are mapped for a range of ion flow speeds.

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Source: https://tomesphere.com/paper/1908.04224