FPGA-based Multi-Chip Module for High-Performance Computing
Yann Beilliard, Maxime Godard, Aggelos Ioannou, Astrinos Damianakis,, Michael Ligerakis, Iakovos Mavroidis, Pierre-Yves Martinez, David Danovitch,, Julien Sylvestre, Dominique Drouin

TL;DR
This paper presents the successful design, fabrication, and testing of FPGA-based multi-chip modules tailored for Exascale high-performance computing, demonstrating high-speed interconnect stability and robust manufacturing quality.
Contribution
It introduces a novel FPGA-based multi-chip module architecture specifically designed for Exascale computing, with successful fabrication and comprehensive testing results.
Findings
High-speed intra-board links stable at 10 Gbps
Successful fabrication with no manufacturing defects
Effective testing of DDR memory and FPGA links
Abstract
Current integration, architectural design and manufacturing technologies are not suited for the computing density and power efficiency requested by Exascale computing. New approaches in hardware architecture are thus needed to overcome the technological barriers preventing the transition to the Exascale era. In that scope, we report successful fabrication of first ExaNoDe's MCM prototypes dedicated to Exascale computing applications. Each MCM was composed of 2 Xilinx Zynq Ultrascale+ MPSoC, assembled on advanced 68.5 mm x 55 mm laminate substrates specifically designed and fabricated for the project. Acoustic microscopy, x-ray, cross-section and Thermo-Moire investigations revealed no voids, shorts, delamination, cracks or warpage issues. Two MCMs were mounted on a daughter board by FORTH for testing purposes. The DDR memories on the 4 SODIMMs of the daughter board were successfully…
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Taxonomy
TopicsEmbedded Systems Design Techniques · VLSI and FPGA Design Techniques
