3D integration and packaging for solid-state qubits

TL;DR

This paper reviews advances in 3D integration and packaging techniques crucial for the operation of solid-state qubits in cryogenic environments, highlighting recent developments and ongoing challenges in quantum device packaging.

Contribution

It provides a comprehensive overview of current 3D packaging strategies for solid-state qubits, emphasizing their importance in quantum computing hardware.

Findings

3D integration enhances qubit performance at cryogenic temperatures

Recent packaging techniques improve qubit coherence and scalability

Community efforts are advancing quantum device packaging solutions

Abstract

Developing a packaging scheme that meets all of the requirements for operation of solid-state qubits in a cryogenic environment can be a formidable challenge. In this article, we discuss work being done in our group as well as in the broader community, focusing on the role of 3D integration and packaging in quantum processing with solid-state qubits.