Van der Waals stacked multilayer in-plane graphene/hexagonal boron nitride heterostructure: its interfacial thermal transport properties
Ting Liang, Ping Zhang, Man Zhou, Peng Yuan, Daoguo Yang

TL;DR
This study investigates the interfacial thermal conductance of multilayer in-plane graphene/hexagonal boron nitride heterostructures, revealing layer-dependent behavior, the influence of stacking angle, and the potential for thermal regulation, challenging previous assumptions.
Contribution
It provides the first systematic analysis of interfacial thermal transport in multilayer in-plane Gr/h-BN heterostructures using NEMD simulations, highlighting new physical insights and control mechanisms.
Findings
ITC decreases with layer number, saturating at three layers
Multilayer heterostructures can outperform monolayers in thermal transport
Stacking angle and interlayer coupling significantly influence ITC
Abstract
Combining both vertical and in-plane two-dimensional (2D) heterostructures opens up the possibility to create an unprecedented architecture using 2D atomic layer building blocks. The thermal transport properties of such mixed heterostructures, critical to various applications in nanoelectronics, however, have not been thoroughly explored. Herein, we construct two configurations of multilayer in-plane graphene/hexagonal boron nitride (Gr/h-BN) heterostructures (i.e. mixed heterostructures) via weak van der Waals (vdW) interactions and systematically investigate the dependence of their interfacial thermal conductance (ITC) on the number of layers using non-equilibrium molecular dynamics (NEMD) simulations. The computational results show that the ITC of two configurations of multilayer in-plane Gr/h-BN heterostructures (MIGHHs) decrease with increasing layer number n and both saturate at n…
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