# 3D Integration: Another Dimension Toward Hardware Security

## TL;DR

This paper reviews how 3D integration can improve hardware security by enhancing resilience and enabling new security schemes, emphasizing careful application and innovative system-level solutions.

## Contribution

It highlights the potential of 3D integration to strengthen hardware security and discusses specific strategies like secure 2.5D systems and shielding techniques.

## Key findings

- 3D integration enhances hardware security resilience
- Secure 2.5D system-level integration is promising
- Shielding techniques can protect 3D ICs effectively

## Abstract

We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it also requires thoughtful use of the options provided by the umbrella term of 3D integration. Toward enforcing security at runtime, we envision secure 2.5D system-level integration of untrusted chips and "all around" shielding for 3D ICs.