# A non-invasive sub-surface electrical probe to encapsulated layers in van der Waals heterostructures

## TL;DR

This paper introduces a non-invasive electrostatic force microscopy technique capable of imaging and characterizing buried two-dimensional layers in van der Waals heterostructures, aiding in device optimization.

## Contribution

The study demonstrates a versatile, fast, and non-invasive method to visualize and analyze encapsulated layers over 30 nm below the surface in heterostructures.

## Key findings

- Effective imaging of buried layers over 30 nm deep
- Distinct work function fingerprints for different materials
- Insights into charge environment and structural imperfections

## Abstract

Van der Waals heterostructures formed by stacking different atomically thin layered materials have emerged as the sought-after device platform for electronic and optoelectronic applications. Determining the spatial extent of all the encapsulated components in such vertical stacks is key to optimal fabrication methods and improved device performance. Here we employ electrostatic force microscopy as a fast and non-invasive microscopic probe that provides compelling images of two dimensional layers buried over 30 nm below the sample surface. We demonstrate the versatility of the technique by studying heterojunctions comprising graphene, hexagonal boron nitride and transition metal dichalcogenides. Work function of each constituent layer acts as a unique fingerprint during imaging, thereby providing important insights into the charge environment, disorder, structural imperfections and doping profile. The technique holds great potential for gaining a comprehensive understanding of the quality, flatness as well as local electrical properties of buried layers in a large class of nanoscale materials and vertical heterostructures.