Terahertz topological photonics for on-chip communication
Yihao Yang, Yuichiro Yamagami, Xiongbin Yu, Prakash Pitchappa, Baile, Zhang, Masayuki Fujita, Tadao Nagatsuma, and Ranjan Singh

TL;DR
This paper demonstrates robust terahertz topological valley transport on silicon chips, enabling high-speed, error-free on-chip communication with minimal losses even through sharp bends, advancing THz communication technology.
Contribution
It provides the first experimental demonstration of topological phases of THz waves on silicon chips, showcasing robust valley transport for high-speed on-chip data transmission.
Findings
Unity transmission over a bulk band gap after ten sharp corners
Error-free data transmission at 10 Gbit/s
Successful uncompressed 4K video transmission
Abstract
The computing speeds in modern multi-core processors and big data servers are no longer limited by the on-chip transistor density that doubles every two years following the Moores law, but are limited by the on-chip data communication between memories and microprocessor cores. Realization of integrated, low-cost, and efficient solutions for high speed, on-chip data communications require terahertz (THz) interconnect waveguides with tremendous significance in future THz technology including THz-wave integrated circuits and THz communication. However, conventional approaches to THz waveguiding suffer from sensitivity to defects and considerable bending losses at sharp bends. Here, building on the recently-discovered topological phase of light, we experimentally demonstrate robust THz topological valley transport on low-loss, all-silicon chips. We show that the valley polarized topological…
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