Explicit relationship between electrical and topological degradation of polymer-supported metal films subjected to mechanical loading

TL;DR

This paper establishes a quantitative relationship between electrical resistance increase and crack parameters in polymer-supported metal films under mechanical stress, verified by experiments and applicable across scales.

Contribution

It introduces an explicit model linking electrical degradation to crack growth, validated by tensile tests, and proposes a universal crack pattern parameter for reliable device design.

Findings

Electrical resistance grows with the fourth power of crack length.

A universal dimensionless factor characterizes crack pattern intensity.

Certain crack patterns do not cause electrical failure, enabling failure-free design.

Abstract

For a comprehensive characterization of mechanical reliability of metallization layers on polymer substrates both electrical and mechanical degradation should be taken into account. Although it is evident that cracking of a conductive film should lead to electrical degradation, the quantitative relationship between the growth of electric resistance and parameters of the induced crack pattern has remained thus far unexplored. With the help of finite element modelling we were able to find an explicit and concise expression which shows that electrical resistance grows with the fourth order of the crack length and second order of the areal crack density. The discovered relationship was verified by comparison with the experimental results of tensile testing of polymer-supported thin metal films. Presented model is independent of the length scale and can be applied to films with different thicknesses as long as Ohm's law is valid. It is demonstrated that linear crack density is an ambiguous parameter which does not properly capture the development of a crack pattern. For the unambiguous characterization of the intensity of a crack pattern a universal dimensionless factor is proposed. Presented results show that there is a wide range of possible crack patterns which do not lead to electrical failure of a conductive film that can be used for failure-free design of flexible electronic devices.