# Results on Proton-Irradiated 3D Pixel Sensors Interconnected to RD53A Readout ASIC

## TL;DR

This study demonstrates that 3D pixel sensors bump-bonded to RD53A ASIC maintain high hit detection efficiency after proton irradiation up to $1\times10^{16}$ n$_{eq}$/cm$^2$, confirming their suitability for high-radiation environments like HL-LHC.

## Contribution

First irradiation test of fine pitch 3D pixel sensors bump-bonded to RD53A ASIC showing no efficiency degradation at high fluence.

## Key findings

- Sensors retain efficiency after irradiation
- 3D sensors are highly radiation tolerant
- Suitable for HL-LHC inner detector layers

## Abstract

Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK (Italy) and IMB-CNM (Spain) have been tested before and after proton-irradiation to an equivalent fluence of about $1$ $\times$ $10^{16}$ $\text{n}_{\text{eq}}$ cm$^{-2}$ (1 MeV equivalent neutrons). This is the first time that one single collecting electrode fine pitch 3D sensors are irradiated up to such fluence bump-bonded to a fine pitch ASIC. The preliminary analysis of the collected data shows no degradation on the hit detection efficiencies of the tested sensors after high energy proton irradiation, demonstrating the excellent radiation tolerance of the 3D pixel sensors. Thus, they will be excellent candidates for the extreme radiation environment at the innermost layers of the HL-LHC experiments.