# Effect of synthesis conditions on the electrical resistivity of TiSe$_2$

**Authors:** Jaime M. Moya, C.-L. Huang, Jesse Choe, Gelu Costin, Matthew S., Foster, E. Morosan

arXiv: 1903.12375 · 2019-09-18

## TL;DR

This study investigates how synthesis conditions like cooling rate and annealing influence the electrical resistivity of TiSe₂, revealing effects such as weak localization and disorder-induced changes in polycrystalline samples.

## Contribution

It provides new insights into how synthesis parameters affect the transport properties and disorder phenomena in TiSe₂, especially in polycrystalline forms.

## Key findings

- Slow cooling increases low-temperature resistivity in polycrystalline TiSe₂.
- Logarithmic resistivity increase and negative magnetoresistance indicate weak localization.
- Quenching from high temperatures reduces low-temperature resistivity by freezing in disorder.

## Abstract

Dilute impurities and growth conditions can drastically affect the transport properties of TiSe$_2$, especially below the charge density wave transition. In this paper, we discuss the effects of cooling rate, annealing time and annealing temperature on the transport properties of TiSe$_2$: slow cooling of polycrystalline TiSe$_2$ post-synthesis drastically increases the low temperature resistivity, which is in contrast to the metallic behavior of single-crystalline TiSe$_2$ due to charge doping from the residual iodine transport agent. A logarithmic increase of resistivity upon cooling and negative magnetoresistance with a sharp cusp around zero field are observed for the first time for the polycrystalline TiSe$_2$ samples, pointing to weak-localization effects due to low dimensionality. Annealing at low temperatures has a similar, but less drastic effect. Furthermore, rapid quenching of the polycrystalline samples from high temperatures freezes in disorder, leading to a decrease in the low temperature resistivity.

## Full text

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## Figures

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## References

40 references — full list in the complete paper: https://tomesphere.com/paper/1903.12375/full.md

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Source: https://tomesphere.com/paper/1903.12375