Combined in situ microstructural study of the relationships between local grain boundary structure and passivation on microcrystalline copper
Mohamed Bettayeb, Vincent Maurice, Lorena H. Klein, Linsey Lapeire,, Kim Verbeken, Philippe Marcusa

TL;DR
This study combines in situ ECSTM and EBSD techniques to explore how different grain boundary structures in microcrystalline copper influence passivation behavior in NaOH solution, revealing structure-dependent passivation efficiency.
Contribution
It provides new insights into the relationship between grain boundary microstructure and passivation, especially the effects of boundary deviation and dislocation density.
Findings
High angle random boundaries form thicker passive films reducing oxidation efficiency.
Sigma3 CSL boundaries show passivation efficiency dependent on boundary deviation angle.
Deviations from ideal CSL boundaries affect local oxidation and passivation behavior.
Abstract
In situ Electro-Chemical Scanning Tunneling Microscopy (ECSTM) and Electron Back-Scatter Diffraction analysis of the same local microstructural region were combined to study the relationships between grain boundary (GB) type and structure and passivation on microcrystalline copper in 0.1 M NaOH aqueous solution. The results show that, for high angle random boundaries, passivation in the Cu(I) oxidation range is characterized by a decrease of the depth of GB edge region due to the formation of a passive film locally thicker than on the adjacent grains and thus to anodic oxidation being locally less efficient since it consumes more copper at the grain boundaries. For sigma3 CSL boundaries, the Cu(I) passivation efficiency was observed to be dependent on the local structure of the boundaries. A transition from more to less efficient passivation was observed for a deviation angle of…
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