# First Results on 3D Pixel Sensors Interconnected to the RD53A Readout Chip after Irradiation to $1\times$$10^{16}$neq cm$^{-2}$

## TL;DR

This paper reports on the performance of 3D pixel sensors interconnected with the RD53A readout chip, tested before and after high-fluence irradiation, demonstrating promising hit detection efficiency for HL-LHC upgrades.

## Contribution

First experimental results on 3D pixel sensors with RD53A chip after extreme irradiation, advancing detector technology for HL-LHC upgrades.

## Key findings

- Hit detection efficiency around 97% after irradiation
- Successful integration of 3D sensors with RD53A chip
- Validation of sensor performance post-irradiation

## Abstract

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about $1\times$$10^{16}$neq cm$^{-2}$ (1MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC). A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.