$\r{A}$-Indentation for non-destructive elastic moduli measurements of supported ultra-hard ultra-thin films and nanostructures
Filippo Cellini, Yang Gao, Elisa Riedo

TL;DR
This paper introduces a novel modulated e5-indentation technique that enables non-destructive, sub-e5 depth measurements of ultra-thin and ultra-stiff films and 2D materials with atomic-scale resolution using standard AFM equipment.
Contribution
The authors develop and demonstrate a new e5-indentation method that achieves sub-e5 depth resolution for ultra-thin films and 2D materials, expanding the capabilities of nanoindentation.
Findings
Achieves indentation depths as small as 0.3 e5.
Provides indentation resolution better than 0.05 e5.
Enables non-destructive elastic modulus measurements of ultra-stiff films.
Abstract
During conventional nanoindentation measurements, the indentation depths are usually larger than 1-10 nm, which hinders the ability to study ultra-thin films ( 10 nm) and supported atomically thin two-dimensional (2D) materials. Here, we discuss the development of modulated \r{A}-indentation to achieve sub-\r{A} indentation depths during force-indentation measurements while also imaging materials with nanoscale resolution. Modulated nanoindentation (MoNI) was originally invented to measure the radial elasticity of multi-walled nanotubes. Now, by using extremely small amplitude oscillations ( 1 \r{A}) at high frequency, and stiff cantilevers, we show how modulated nano/\r{A}-indentation (MoNI/\r{A}I) enables non-destructive measurements of the contact stiffness and indentation modulus of ultra-thin ultra-stiff films, including CVD diamond films (modulus 1000 GPa), as well…
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Taxonomy
TopicsForce Microscopy Techniques and Applications · Metal and Thin Film Mechanics · Diamond and Carbon-based Materials Research
