# Chalcogen Assisted Enhanced Atomic Orbital Interaction at TMDs - Metal   Interface & Chalcogen Passivation of TMD Channel For Overall Performance   Boost of 2D TMD FETs

**Authors:** Ansh, Jeevesh Kumar, Gaurav Sheoran, Harsha B. Variar, Ravi K. Mishra,, Hemanjaneyulu Kuruva, Adil Meersha, Abhishek Mishra, Srinivasan Raghavan and, Mayank Shrivastava

arXiv: 1901.02150 · 2020-02-19

## TL;DR

This paper presents a universal dry chemistry approach to enhance atomic orbital interaction at TMD-metal interfaces and passivate TMD channels, significantly improving the performance of 2D TMD FETs through experimental and atomistic investigations.

## Contribution

It introduces a novel chalcogen-assisted method to reduce contact resistance and passivate TMD channels, leading to substantial performance improvements in 2D TMD FETs.

## Key findings

- Contact resistance reduced by up to 86 times in WSe2.
- Overall device performance improved to match state-of-the-art FETs.
- Enhanced orbital interaction verified by atomistic simulations and experiments.

## Abstract

Metal-semiconductor interface is a bottleneck for efficient transport of charge carriers through Transition Metal Dichalcogenide (TMD) based field-effect transistors (FETs). Injection of charge carriers across such interfaces is mostly limited by Schottky barrier at the contacts which must be reduced to achieve highly efficient contacts for carrier injection into the channel. Here we introduce a universal approach involving dry chemistry to enhance atomic orbital interaction between various TMDs (MoS2, WS2, MoSe2 and WSe2) & metal contacts has been experimentally demonstrated. Quantum chemistry between TMDs, Chalcogens and metals has been explored using detailed atomistic (DFT & NEGF) simulations, which is then verified using Raman, PL and XPS investigations. Atomistic investigations revealed lower contact resistance due to enhanced orbital interaction and unique physics of charge sharing between constituent atoms in TMDs with introduced Chalcogen atoms which is subsequently validated through experiments. Besides contact engineering, which lowered contact resistance by 72, 86, 1.8, 13 times in MoS2, WS2, MoSe2 and WSe2 respectively, a novel approach to cure / passivate dangling bonds present at the 2D TMD channel surface has been demonstrated. While the contact engineering improved the ON-state performance (ION, gm, mobility and RON) of 2D TMD FETs by orders of magnitude, Chalcogen based channel passivation was found to improve gate control (IOFF, SS, & VTH) significantly. This resulted in an overall performance boost. The engineered TMD FETs were shown to have performance on par with best reported till date.

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Source: https://tomesphere.com/paper/1901.02150