# A wet etching method for few-layer black phosphorus with an atomic   accuracy and compatibility with major lithography techniques

**Authors:** Teren Liu, Tao Fang, Karen Kavanagh, Guangrui (Maggie) Xia

arXiv: 1901.01682 · 2019-01-08

## TL;DR

This paper introduces a precise wet etching technique for few-layer black phosphorus that achieves atomic accuracy, is compatible with standard lithography, and enables scalable device fabrication.

## Contribution

A novel wet etching process for black phosphorus with atomic layer precision, compatible with common lithography methods, facilitating large-scale device manufacturing.

## Key findings

- Achieved atomic layer accuracy in black phosphorus etching.
- Compatible with deep-UV and e-beam lithography.
- Suitable for large-scale black phosphorus device fabrication.

## Abstract

This paper reports a few-layer black phosphorus thickness pattern fabricated by a top-down nanofabrication approach. This was achieved by a new wet etching process that can etch selected regions of few-layer black phosphorus with an atomic layer accuracy. This method is deep-UV and e-beam lithography process compatible,and is free of oxygen and other common doping sources. It provides a feasible patterning approach for largescale manufacturing of few-layer BP materials and devices.

## Full text

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## Figures

25 figures with captions in the complete paper: https://tomesphere.com/paper/1901.01682/full.md

## References

46 references — full list in the complete paper: https://tomesphere.com/paper/1901.01682/full.md

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Source: https://tomesphere.com/paper/1901.01682