# High-Precision Contactless Optical 3D-Metrology of Silicon Sensors

## TL;DR

This paper presents a contactless optical 3D metrology system for silicon sensors, combining video microscopy, a high-precision XY-table, and Fourier analysis to achieve micron-level accuracy in sensor positioning.

## Contribution

It introduces a novel setup and procedure for high-precision, contactless 3D measurement of silicon micro-strip sensors using optical methods and image analysis.

## Key findings

- Achieved micron-level measurement precision.
- Successfully measured silicon sensors mounted on complex structures.
- Demonstrated the effectiveness of Fourier analysis for Z-dimension measurement.

## Abstract

We describe a setup and procedures for contactless optical 3D-metrology of silicon micro-strip sensors. Space points are obtained by video microscopy and a high precision XY-table. The XY-dimensions are obtained from the movement of the table and pattern recognition, while the Z-dimension results from a Fast Fourier Transformation analyses of microscopic images taken at various distances of the optical system from the object under investigation. The setup is employed to measure the position of silicon sensors mounted onto a carbon fibre structure with a precision of a few microns.