A low-disorder Metal-Oxide-Silicon double quantum dot
Jin-Sung Kim, Thomas M. Hazard, Andrew A. Houck, Stephen A. Lyon

TL;DR
This paper reports the development of a low-disorder MOS quantum double-dot device with low critical electron densities, enabling single-electron control and demonstrating potential for scalable MOS-based spin qubits.
Contribution
The work introduces a low-disorder MOS quantum dot device with near-ideal critical densities, enabling single-electron regime operation and detailed characterization of charge traps and valley splitting.
Findings
Achieved critical electron densities comparable to high-quality Si/SiGe devices
Measured charging energies around 8 meV consistent with dot size
Detected three electron traps and characterized charge noise and valley splitting
Abstract
One of the biggest challenges impeding the progress of Metal-Oxide-Silicon (MOS) quantum dot devices is the presence of disorder at the Si/SiO interface which interferes with controllably confining single and few electrons. In this work we have engineered a low-disorder MOS quantum double-dot device with critical electron densities, i.e. the lowest electron density required to support a conducting pathway, approaching critical electron densities reported in high quality Si/SiGe devices and commensurate with the lowest critical densities reported in any MOS device. Utilizing a nearby charge sensor, we show that the device can be tuned to the single-electron regime where charging energies of 8 meV are measured in both dots, consistent with the lithographic size of the dot. Probing a wide voltage range with our quantum dots and charge sensor, we detect three distinct electron…
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