Nanoscale Intergranular Corrosion and Relation With Grain Boundary Character as Studied In Situ on Copper
Mohamed Bettayeb, Vincent Maurice, Lorena H. Klein, Linsey Lapeire,, Kim Verbeken, Philippe Marcus

TL;DR
This study investigates how different grain boundary types in copper influence nanoscale intergranular corrosion initiation, using in situ electrochemical microscopy and microstructural analysis to reveal the dependence on boundary character.
Contribution
It introduces an innovative methodology combining ECSTM and EBSD with micro marking to analyze corrosion at specific grain boundaries in copper.
Findings
Random high angle and sigma9 boundaries are susceptible to corrosion.
Sigma3 twin boundaries show resistance or susceptibility depending on deviation angle.
Corrosion initiation is highly dependent on grain boundary character and misorientation.
Abstract
The initiation of intergranular corrosion at various types of grain boundaries (GBs) was studied at the nanometer scale on microcrystalline copper in 1 mM HCl aqueous solution. In situ Electrochemical Scanning Tunneling Microscopy (ECSTM) and Electron Back-Scatter Diffraction analysis of the same local microstructural region were combined using an innovative methodology including micro marking performed with the STM tip. The results demonstrate that electrochemically-induced intergranular dissolution, at the surface termination of GBs, is dependent on the grain boundary character. It is found that random high angle boundaries as well as sigma9 coincidence site lattice (CSL) boundaries are susceptible to nanoscale initiation of intergranular corrosion while for sigma3 CSL boundaries the behavior is dependent on the deviation angle of the GB plane from the exact orientation. For the…
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