High-performance InSe Transistors with Ohmic Contact Enabled by Nonrectifying-barrier-type Indium Electrodes

TL;DR

This paper demonstrates high-performance InSe transistors with ohmic contacts achieved through indium electrodes, significantly reducing contact resistance and enhancing device performance in 2D semiconductor electronics.

Contribution

It introduces a novel nonrectifying barrier contact method using indium electrodes for InSe transistors, enabling high current and mobility at low temperatures.

Findings

Achieved an ON-current of 410 μA/μm in InSe FEDs.

Realized high electron mobility of 3,700 cm²/Vs at 2 K.

Confirmed reduced interface barrier via X-ray photoelectron spectroscopy.

Abstract

The electrical contact to two-dimensional (2D)-semiconductor materials are decisive to the electronic performance of 2D-semiconductor field-effect devices (FEDs). The presence of a Schottky barrier often leads to a large contact resistance, which seriously limits the channel conductance and carrier mobility measured in a two-terminal geometry. In contrast, ohmic contact is desirable and can be achieved by the presence of a nonrectifying or tunneling barrier. Here, we demonstrate that an nonrectifying barrier can be realized by contacting indium (In), a low work function metal, with layered InSe because of a favorable band alignment at the In-InSe interface. The nonrectifying barrier is manifested by ohmic contact behavior at T=2 K and a low barrier height, {\Phi}$_B$=50 meV. This ohmic contact enables demonstration of an ON-current as large as 410 {\mu}A/{\mu}m, which is among the highest values achieved in FEDs based on layered semiconductors. A high electron mobility of 3,700 and 1,000 cm$^2$/Vs is achieved with the two-terminal In-InSe FEDs at T=2 K and room temperature, respectively, which can be attributed to enhanced quality of both conduction channel and the contacts. The improvement in the contact quality is further proven by an X-ray photoelectron spectroscopy study, which suggests that a reduction effect occurs at the In-InSe interface. The demonstration of high-performance In-InSe FEDs indicates a viable interface engineering method for next-generation, 2D-semiconductor-based electronics.