Self Healing Interconnects with a Near Plastically Stretchable Heal
Amit Kumar, Virendra Parab, Arindan Handu, Li Ding, Sanjiv Sambandan

TL;DR
This paper presents a novel self-healing interconnect technology that uses conductive particle dispersions to automatically repair faults, achieving high conductivity and near-plastic stretchability for flexible electronics.
Contribution
It introduces a self-healing method using conductive particle dispersions that enables stretchable, copper-based interconnects with automatic fault repair capabilities.
Findings
Conductivity of about 5 x 10^5 S/m in healed interconnects
Stretchability allowing strains from 12% to 60%
Automatic healing triggered by electric field in open gaps
Abstract
Flexible electronic systems such as roll up displays, wearable devices etc. promise exciting possibilities that could change the way humans interact with the environment. However, they suffer from poor reliability of interconnects and devices. Interconnects on flex are prone to open circuit failures due to mechanical stress, electrostatic discharge and environmental degradation. Passive approaches such as the use of stretchable conductors and novel geometries improve their response to mechanical stress but cannot salvage the interconnect if a fault were to occur. Active approaches using self healing techniques can repair a fault and have been demonstrated using methods that either use relatively rare materials, change conventional interconnect fabrication processes, only address faults due to mechanical stress or do not permit stretching. In this work we discuss a self healing technique…
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