Thermally Activated Motion of Dislocations in Fields of Obstacles: Effect of Obstacle Distribution

TL;DR

This study uses computer simulations to analyze how dislocations move through obstacle fields, revealing how obstacle distribution and temperature influence material strength and deformation behavior.

Contribution

It introduces a model predicting strain rate sensitivity and transition stress considering obstacle distribution and clustering effects.

Findings

Dislocation motion transitions from smooth to jerky at a threshold stress.

Obstacle clustering affects high-stress deformation but not low-stress creep.

Models should incorporate higher moments of obstacle density for accuracy.

Abstract

The thermally activated motion of dislocations across fields of obstacles distributed at random and in a correlated manner, in separate models, is studied by means of computer simulations. The strain rate sensitivity and strength are evaluated in terms of the obstacle strength, temperature and applied shear stress. Above a threshold stress, the dislocation motion undergoes a transition from smooth to jerky, i.e. obstacles are overcome in a correlated manner at high stresses, while at low stresses they are overcome individually. This leads to a significant reduction of the strain rate sensitivity. The threshold stress depends on the obstacle strength and temperature. A model is proposed to predict the strain rate sensitivity and the smooth-to-jerky transition stress. Obstacle clustering has little effect on strain rate sensitivity at low stress (creep conditions), but it becomes important at high stress. It is concluded that models for the strength and strain rate sensitivity should include higher moments of the obstacle density distribution in addition to the mean density.