In-Plane Mechanical Properties of Ultrathin 2D Hybrid Organic-Inorganic Perovskites

TL;DR

This study investigates the in-plane mechanical properties of ultrathin 2D hybrid organic-inorganic perovskites, revealing their potential for flexible electronic applications due to their high strength-to-modulus ratio.

Contribution

First measurement of in-plane mechanical properties of ultrathin 2D HOIPs and analysis of how these properties depend on membrane thickness.

Findings

Young's modulus of 2D HOIPs is lower than traditional 2D materials.

Young's modulus and breaking strength decrease then plateau with increasing thickness.

Ultrathin 2D HOIPs have a high strength-to-modulus ratio, suitable for flexible electronics.

Abstract

Two-dimensional (2D) hybrid organic-inorganic perovskites (HOIPs) are new members of the 2D materials family with wide tunability, highly dynamic structural features and excellent physical properties. Ultrathin 2D HOIPs and their heterostructures with other 2D materials have been exploited for study of new physical phenomena and novel device applications. The in-plane mechanical properties of 2D ultrathin HOIPs are critical for understanding the coupling between mechanical and other physical fields and for integrated devices applications. Here we report for the first time the in-plane mechanical properties of ultrathin freestanding 2D lead iodide perovskite membranes and their dependence on the membrane thickness. The in-plane Young's moduli of 2D HOIPs are smaller than that of conventional covalently bonded 2D materials. Both the Young's modulus and breaking strength first decrease and then plateau as the thickness increases from monolayer to 4 layers due to interlayer slippage during deformation. Our results show that ultrathin 2D HOIPs exhibit outstanding breaking strength/Young's Modulus ratio compared to many other widely used engineering materials and polymeric flexible substrates, which renders them suitable for application into flexible electronic devices.