Kinetic Model for Stochastic Heating in the INCA Discharge
Uwe Czarnetzki

TL;DR
This paper develops analytical models to understand the collisionless stochastic electron heating mechanism in the INCA plasma discharge, revealing non-local in-plane heating effects and providing explicit expressions for plasma conductivity and heating conditions.
Contribution
It introduces two analytical models that elucidate the physical mechanism of stochastic heating in INCA discharges, including effects of non-local in-plane heating and elastic collisions.
Findings
Heating is non-local in the plane but local vertically.
Explicit expressions for complex conductivity and damping coefficient.
Condition for stochastic heating dominance over Ohmic heating.
Abstract
A novel electron heating mechanism based on periodically structured vortex fields induced in a plane was first proposed in 2014 [U. Czarnetzki and Kh. Tarnev, Physics of Plasmas 21, 123508 (2014)]. This theoretical concept has now been realized in an experiment which confirms efficient collisionless heating in such array structures [Ph. Ahr, T.V. Tsankov, J. Kuhfeld, U. Czarnetzki, submitted to Plasma Sources Science and Technology, arXiv:1806.02043v1 (2018)]. The new concept is called "Inductively Coupled Array": INCA. Here, the physical mechanism behind the collisionless (stochastic) heating is investigated by two analytical models. Firstly, the electron heating rate in an array field structure with an exponential spatial decay of the field in the direction perpendicular to the plane is investigated by stochastically averaging single electron trajectories. The approach is similar to…
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Taxonomy
TopicsPlasma Diagnostics and Applications · Plasma Applications and Diagnostics · Advancements in Semiconductor Devices and Circuit Design
