Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive
S\'ebastien Genty, Philippe Tingaut, Ma\"elenn Aufray

TL;DR
This study demonstrates that infrared radiation can rapidly cure epoxy-amine adhesives at low temperatures within minutes, potentially enabling a cold, on-demand curing process without catalysts or accelerators.
Contribution
It reveals the role of non-thermal effects in infrared curing, showing how infrared radiation accelerates polymerization by reducing energy barriers in epoxy-amine reactions.
Findings
Infrared curing achieves rapid polymerization in minutes at low temperature.
Non-thermal effects contribute to accelerated curing via infrared radiation absorption.
Curing process does not require initiators, catalysts, or accelerators.
Abstract
In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are two-component adhesives that cure slowly at room temperature and can reach full polymerization in minutes, on demand. In this paper, the curing behavior of a model poly-epoxide adhesive (a stoichiometric mixture of a pure epoxy and amine) polymerized with infrared radiation will be studied. The kinetic follow-up of this polymerization will be carried out by thermal analysis (determination of the residual heat peak by Differential Scanning Calorimetry-DSC). This study paves the way to a cold and universal cure-on-demand process, which means achieved in few minutes at low temperature without any…
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