Enabling the Adoption of Processing-in-Memory: Challenges, Mechanisms, Future Research Directions
Saugata Ghose, Kevin Hsieh, Amirali Boroumand, Rachata, Ausavarungnirun, Onur Mutlu

TL;DR
This paper discusses the challenges and mechanisms for adopting processing-in-memory (PIM) architectures using 3D-stacked DRAM, proposing solutions to improve performance and energy efficiency while maintaining compatibility with existing memory models.
Contribution
It introduces two general-purpose mechanisms that enable efficient access to CPU structures from DRAM logic, facilitating PIM adoption without extensive off-chip communication.
Findings
Both mechanisms improve application performance.
Energy consumption is significantly reduced.
Enhances compatibility with virtual memory and shared memory models.
Abstract
Poor DRAM technology scaling over the course of many years has caused DRAM-based main memory to increasingly become a larger system bottleneck. A major reason for the bottleneck is that data stored within DRAM must be moved across a pin-limited memory channel to the CPU before any computation can take place. This requires a high latency and energy overhead, and the data often cannot benefit from caching in the CPU, making it difficult to amortize the overhead. Modern 3D-stacked DRAM architectures include a logic layer, where compute logic can be integrated underneath multiple layers of DRAM cell arrays within the same chip. Architects can take advantage of the logic layer to perform processing-in-memory (PIM), or near-data processing. In a PIM architecture, the logic layer within DRAM has access to the high internal bandwidth available within 3D-stacked DRAM (which is much greater…
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Taxonomy
TopicsAdvanced Memory and Neural Computing · Advanced Data Storage Technologies · Parallel Computing and Optimization Techniques
