Superconductor Electronics Fabrication Process with MoN$_x$ Kinetic Inductors and Self-Shunted Josephson Junctions
Sergey K. Tolpygo, Vladimir Bolkhovsky, D.E. Oates, R. Rastogi, S., Zarr, A.L. Day, T.J. Weir, Alex Wynn, and L.M. Johnson

TL;DR
This paper introduces a new superconductor electronics fabrication process utilizing MoN$_x$ kinetic inductors and self-shunted Josephson junctions to enable higher integration density in SFQ circuits.
Contribution
Development of a fabrication process with self-shunted high-J$_c$ JJs and compact MoN$_x$ kinetic inductors, reducing circuit area and improving integration scale.
Findings
MoN$_x$ films with T$_c$ up to 8 K and tunable inductance were characterized.
Nb-based self-shunted JJs with various tunnel barriers were fabricated and tested.
Electron transport in Si$_{1-x}$Nb$_x$ barriers varies with x, affecting junction performance.
Abstract
Recent progress in superconductor electronics fabrication has enabled single-flux-quantum (SFQ) digital circuits with close to one million Josephson junctions (JJs) on 1-cm chips. Increasing the integration scale further is challenging because of the large area of SFQ logic cells, mainly determined by the area of resistively shunted Nb/AlO-Al/Nb JJs and geometrical inductors utilizing multiple layers of Nb. To overcome these challenges, we are developing a fabrication process with self-shunted high-J JJs and compact thin-film MoN kinetic inductors instead of geometrical inductors. We present fabrication details and properties of MoN films with a wide range of T, including residual stress, electrical resistivity, critical current, and magnetic field penetration depth {\lambda}. As kinetic inductors, we implemented MoN films with T about 8 K,…
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