Uneven Current Distribution Modeling and Random Walk based Variation Analysis for interconnect Electromigration Estimation

TL;DR

This paper models uneven current distribution in on-die interconnects and introduces a random walk based method to evaluate electromigration reliability, revealing significant variation effects on EM degradation.

Contribution

It presents a novel random walk based approach for assessing on-die electromigration variation effects, enhancing reliability analysis accuracy.

Findings

Uneven current distribution significantly impacts EM reliability.

The proposed method effectively identifies weak interconnects.

Experimental results confirm increased EM degradation due to variations.

Abstract

In this paper, we modeled and simulated uneven current distribution for on-die interconnect structure. We show significant difference when considering uneven current distribution. Finite Element Method approach is used to analyze various variation effects. Blech length effect and analytical EM lifetime calculation is used to quickly identify on-die EM weak wires. We propose a random walk based approach to evaluate on-die variation impact on electromigration reliability. Experimental results show substantial EM degradation with variation effects present.