Study and calculation of thermal conductance of thermal infrared detectors using finite element method

TL;DR

This paper models and optimizes the thermal conductance of multilayer infrared detectors using finite element analysis, highlighting the impact of substrate properties and boundary conditions on detector response.

Contribution

It presents a comprehensive FEM model for thermal infrared detectors, including all conductance contributions and optimization strategies for improved responsivity.

Findings

Reducing substrate thermal conductivity enhances detector response.

Vacuum packing increases detector responsivity.

Optimal detector performance achieved with small substrate thickness and conductivity.

Abstract

In this paper, a multilayer thermal infrared detector model has been achieved by finite element method (FEM). All contributions of the thermal conductance were taken into account and calculated. In order to maximize the detector response, it is necessary to reduce the thermal conductance. Dynamic simulation in 3D was used to optimize this FEM model. The effect of the substrate properties of the detector on its response has been studied. Moreover, different boundary conditions have been analyzed. Optimal detector response values are obtained when the substrate thermal conductivity and its thickness are small. Moreover, a vacuum packing of the detector will be necessary to increase the detector responsivity.