Obfuscating the Interconnects: Low-Cost and Resilient Full-Chip Layout Camouflaging
Satwik Patnaik, Mohammed Ashraf, Johann Knechtel, Ozgur Sinanoglu

TL;DR
This paper introduces a low-cost, generic full-chip layout camouflaging scheme based on interconnect obfuscation, which enhances security against reverse engineering and SAT attacks while maintaining acceptable overheads.
Contribution
The authors propose a novel, scalable layout camouflaging method that applies to the entire chip via BEOL interconnect obfuscation, addressing limitations of prior FEOL-centric techniques.
Findings
Significantly lower cost than previous methods
Achieves 12% power, 30% performance, 48% area overheads at 100% camouflaging
Effective against SAT attacks with large-scale camouflaging
Abstract
Layout camouflaging (LC) is a promising technique to protect chip design intellectual property (IP) from reverse engineers. Most prior art, however, cannot leverage the full potential of LC due to excessive overheads and/or their limited scope on an FEOL-centric and accordingly customized manufacturing process. If at all, most existing techniques can be reasonably applied only to selected parts of a chip---we argue that such "small-scale or custom camouflaging" will eventually be circumvented, irrespective of the underlying technique. In this work, we propose a novel LC scheme which is low-cost and generic---full-chip LC can finally be realized without any reservation. Our scheme is based on obfuscating the interconnects (BEOL); it can be readily applied to any design without modifications in the device layer (FEOL). Applied with split manufacturing in conjunction, our approach is the…
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