Evaluation of bulk-interface contributions to Edelstein magnetoresistance at metal/oxide interfaces
Junyeon Kim, Yan-Ting Chen, Shutaro Karube, Saburo Takahashi, Kouta, Kondou, Gen Tatara, and YoshiChika Otani

TL;DR
This study investigates how bulk and interface effects influence Edelstein magnetoresistance in metal/oxide heterostructures, revealing key insights into spin relaxation mechanisms and temperature independence of spin transport.
Contribution
The paper introduces a comprehensive analytical model that distinguishes bulk and interface contributions to Edelstein MR, advancing understanding of spin relaxation at Rashba interfaces.
Findings
Edelstein MR depends on Cu thickness and temperature.
The model quantifies the ratio of spin relaxation inside and outside the interface.
Spin transport properties are unaffected by temperature.
Abstract
We report a systematic study on Edelstein magnetoresistance (Edelstein MR) in Co25Fe75/Cu/Bi2O3 heterostructures with a strong spin-orbit interaction at the Cu/Bi2O3 interface. We succeed in observing a significant dependence of the Edelstein MR on both Cu layer thickness and temperature, and also develop a general analytical model considering distinct bulk and interface contributions on spin relaxation. Our analysis, based on the above model, quantitatively illustrates a unique property of the spin transport near the Rashba interface, revealing a prominent role of the spin relaxation process by determining the ratios of the spin relaxation inside and outside the interface. We further find the characteristic spin transport is unaffected by temperature. Our results provide an essential tool for exploring the transport in a system with spin-momentum-locked two-dimensional states.
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
