An Extended Analytic Model for the Heating of Bondwires

TL;DR

This paper introduces an improved analytic model for calculating the temperature distribution along bondwires in electronic packages, accounting for interactions with the surrounding material and validated against experimental data.

Contribution

It presents a novel extended analytic formula that accurately models bondwire heating by coupling heat transfer equations with the surrounding compound, improving upon previous simplified models.

Findings

The model accurately predicts bondwire temperature profiles.

Experimental validation shows improved precision over existing models.

The approach effectively captures the thermal interaction between wire and package.

Abstract

We present an extended analytic formula for the calculation of the temperature profile along a bondwire embedded in a package. The resulting closed formula is built by coupling the heat transfer equations of the bondwire and the surrounding moulding compound by means of auxiliary variables that stem from an \emph{ad-hoc} linearisation and mediate the wire-mould thermal interaction. The model, which corrects typical simplifications in previously introduced analytic models, is also optimised against carefully taken experimental samples representing fusing events of bondwires within real packages.