Impurity effects on the grain boundary cohesion in copper

TL;DR

This study investigates how different impurities at grain boundaries affect the mechanical cohesion of copper, revealing that sulfur embrittles the metal while phosphorus does not, based on chemical and strain contributions.

Contribution

The paper introduces a unified approach to analyze impurity segregation effects on grain boundary cohesion, emphasizing the role of electronegativity differences in copper alloys.

Findings

Sulfur segregation reduces grain boundary cohesion, causing embrittlement.

Phosphorus segregation does not cause embrittlement, as it favors dislocation emission.

Chemical contributions correlate with electronegativity differences between Cu and impurities.

Abstract

Segregated impurities at grain boundaries can dramatically change the mechanical behavior of metals, while the mechanism is still obscure in some cases. Here, we suggest an unified approach to investigate segregation and its effects on the mechanical properties of polycrystalline alloys using the example of 3$sp$ impurities (Mg, Al, Si, P, or S) at a special type $\Sigma 5(310)[001]$ tilt grain boundary in Cu. We show that for these impurities segregating to the grain boundary the strain contribution to the work of grain boundary decohesion is small and that the chemical contribution correlates with the electronegativity difference between Cu and the impurity. The strain contribution to the work of dislocation emission is calculated to be negative, while the chemical contribution to be always positive. Both the strain and chemical contributions to the work of dislocation emission generally become weaker with the increasing electronegativity from Mg to S. By combining these contributions together we find, in agreement with experimental observations, that a strong segregation of S can reduce the work of grain boundary separation below the work of dislocation emission, thus embrittling Cu, while such an embrittlement cannot be produced by a P segregation because it lowers the energy barrier for dislocation emission relatively more than for work separation.