Modification of low-temperature silicon dioxide films under the influence of technology factors

TL;DR

This study investigates how various technological factors such as ion implantation, laser irradiation, and annealing influence the structure, composition, and electrical properties of low-temperature silicon dioxide films produced by different methods.

Contribution

It provides a comprehensive analysis of how substrate type and processing conditions modify low-temperature silicon dioxide films' properties.

Findings

Modification efficiency varies with substrate type.

Annealing and ion implantation significantly alter film properties.

Different fabrication methods produce films with distinct characteristics.

Abstract

The structure, composition and electrophysical characteristics of low-temperature silicon dioxide films under influence of various technology factors, such as ion implantation, laser irradiation, thermal and photonic annealing, have been studied. Silicon dioxide films have been obtained by monosilane oxidation using plasma chemical method, reactive cathode sputtering, and tetraethoxysilane pyrolysis. In the capacity of substrates, germanium, silicon, gallium arsenide and gallium nitride were used. Structure and composition of the dielectric films were analyzed by methods of infrared transmission spectroscopy and frustrated internal reflectance spectroscopy. Analysis of modification efficiency of low-temperature silicon dioxide films has been made depending on the substrate type, structure and properties of the films, their moisture permeability, dielectric deposition technique, type and dose of implantation ions, temperature and kind of annealing.