Radiation hardness of small-pitch 3D pixel sensors up to HL-LHC fluences
J. Lange, S. Grinstein, M. Manna, G. Pellegrini, D. Quirion, S. Terzo,, D. V\'azquez Furelos

TL;DR
This paper reports on the development and testing of small-pitch 3D silicon pixel sensors for HL-LHC, demonstrating high radiation tolerance and low operational voltage at extreme fluences.
Contribution
It introduces a new generation of small-pitch 3D pixel sensors with improved radiation hardness suitable for HL-LHC upgrades.
Findings
Achieved 97% hit efficiency at 1.4×10^{16} n_{eq}/cm^{2} fluence with only 100 V.
Power dissipation remains low at 13 mW/cm^{2} at -25°C.
Operational voltage is significantly lower than previous sensor generations.
Abstract
A new generation of 3D silicon pixel detectors with a small pixel size of 5050 and 25100 m is being developed for the HL-LHC tracker upgrades. The radiation hardness of such detectors was studied in beam tests after irradiation to HL-LHC fluences up to n/cm. At this fluence, an operation voltage of only 100 V is needed to achieve 97% hit efficiency, with a power dissipation of 13 mW/cm at -25C, considerably lower than for previous 3D sensor generations and planar sensors.
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Taxonomy
TopicsParticle Detector Development and Performance · Radiation Detection and Scintillator Technologies · CCD and CMOS Imaging Sensors
