Atomic-scale Structural and Chemical Characterization of Hexagonal Boron Nitride Layers Synthesized at the Wafer-Scale with Monolayer Thickness Control
Wei-Hsiang Lin, Victor W. Brar, Deep Jariwala, Michelle C. Sherrott,, Wei-Shiuan Tseng, Chih-I Wu, Nai-Chang Yeh, and Harry A. Atwater

TL;DR
This study provides detailed atomic-scale and chemical characterization of wafer-scale CVD-grown hexagonal boron nitride layers with controlled monolayer thickness, demonstrating their uniformity and potential as high-quality dielectric materials.
Contribution
It presents the synthesis, precise thickness control, and comprehensive characterization of large-area h-BN films, highlighting their structural, chemical, and electronic uniformity.
Findings
High crystalline quality in monolayer h-BN on Au and graphene/Au substrates.
Uniform thickness control across wafer-scale areas.
Excellent tunnel barrier properties with high breakdown strength.
Abstract
Hexagonal boron nitride (h-BN) is a promising two-dimensional insulator with a large band gap and low density of charged impurities that is isostructural and isoelectronic with graphene. Here we report the chemical and atomic-scale structure of CVD-grown wafer-scale (~25 cm2) h-BN sheets ranging in thickness from 1-20 monolayers. Atomic-scale images of h-BN on Au and graphene/Au substrates obtained by scanning tunneling microscopy (STM) reveal high h-BN crystalline quality in monolayer samples. Further characterization of 1-20 monolayer samples indicates uniform thickness for wafer-scale areas; this thickness control is a result of precise control of the precursor flow rate, deposition temperature and pressure. Raman and infrared spectroscopy indicate the presence of B-N bonds and reveal a linear dependence of thickness with growth time. X-ray photoelectron spectroscopy (XPS) shows the…
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Taxonomy
TopicsGraphene research and applications · 2D Materials and Applications · Advancements in Semiconductor Devices and Circuit Design
