# Tent--Shaped Surface Morphologies of Silicon: Texturization by Metal   Induced Etching

**Authors:** Priyanka Yogi, Deepika Poonia, Suryakant Mishra, Shailendra K. Saxena,, Swarup Roy, Pankaj R Sagdeo, Rajesh Kumar

arXiv: 1705.02674 · 2017-05-09

## TL;DR

This study investigates how metal nanoparticle-induced chemical etching creates tent-shaped silicon nanostructures on different silicon types, revealing consistent morphology with certain metal-semiconductor combinations and potential for field emission applications.

## Contribution

It demonstrates a simple method to produce tent-shaped silicon nanostructures using Ag and Au nanoparticles on n- and p-type silicon wafers, respectively, with detailed morphological analysis.

## Key findings

- Tent-shaped silicon nanostructures are formed with Ag on n-type silicon.
- Tent-shaped silicon nanostructures are formed with Au on p-type silicon.
- Different metal-semiconductor combinations lead to varied surface morphologies.

## Abstract

Nano--metal/semiconductor junction dependent porosification of silicon (Si) has been studied here. The silicon (Si) nanostructures (NS) have been textured on n-- and p-- type silicon wafers using Ag and Au metal nano particles induced chemical etching. The combinations of n--Si/Ag and p--Si/Au form ohmic contact and result in the same texturization on the Si surface on porosification where tent--shaped morphology has been observed consistently with n-- and p--type Si. Whereas, porosification result in different surface texturization for other two combinations (p--Si/Ag and n--Si/Au) where Schottkey contacts are formed. Quantitative analysis have been done using ImageJ to process the SEM images of SiNS, which confirms that the tent like SiNS are formed when etching of silicon wafer is done by AgNPs and AuNPs on n and p type Si wafer respectively. These easily prepared sharp tent--shaped Si NSs can be used for enhanced field emission applications.

## Full text

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## Figures

5 figures with captions in the complete paper: https://tomesphere.com/paper/1705.02674/full.md

## References

35 references — full list in the complete paper: https://tomesphere.com/paper/1705.02674/full.md

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Source: https://tomesphere.com/paper/1705.02674