# Extensible 3D architecture for superconducting quantum computing

## TL;DR

This paper introduces a 3D packaging architecture for superconducting quantum chips using multi-layered PCBs, enabling scalable quantum computing with successful multi-qubit operations.

## Contribution

It presents a novel 3D architecture with flip-chip packaging for superconducting qubits, demonstrating its feasibility for scalable quantum systems.

## Key findings

- Successful packaging of multi-qubit chip
- Performed single- and two-qubit gate operations
- Indicates promising scalability for quantum computing

## Abstract

Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the buried coplanar waveguides protrude from the surface of a dielectric layer as contacts. Since the contacts extend beyond the surface of the dielectric layer, chips can simply be flip-chip packaged with on-chip receptacles clinging to the contacts. Using this scheme, we packaged a multi-qubit chip and per- formed single-qubit and two-qubit quantum gate operations. The results indicate that this 3D architecture provides a promising scheme for scalable quantum computing.