# Thermocompression Bonding Technology for Multilayer Superconducting Quantum Circuits

## TL;DR

This paper introduces a thermocompression indium bonding technique for stacking superconducting quantum chips, demonstrating low resistance and good microwave performance suitable for scalable quantum computing architectures.

## Contribution

It presents a novel chip-to-chip bonding method using indium films, enabling scalable multilayer superconducting quantum circuits with minimal microwave reflection.

## Key findings

- Achieved low dc bond resistance of 515 nΩ·mm² at 10 mK.
- Demonstrated minimal microwave reflections up to 6.8 GHz.
- Successfully fabricated and tested superconducting resonators with the bonding technology.

## Abstract

Extensible quantum computing architectures require a large array of quantum devices operating with low error rates. A quantum processor based on superconducting quantum bits can be scaled up by stacking microchips that each perform different computational functions. In this article, we experimentally demonstrate a thermocompression bonding technology that utilizes indium films as a welding agent to attach pairs of lithographically-patterned chips. We perform chip-to-chip indium bonding in vacuum at $190^{\circ}C$ with indium film thicknesses of $150 nm$. We characterize the dc and microwave performance of bonded devices at room and cryogenic temperatures. At $10 mK$, we find a dc bond resistance of $515 n{\Omega}mm^2$. Additionally, we show minimal microwave reflections and good transmission up to $6.8 GHz$ in a tunnel-capped, bonded device as compared to a similar uncapped device. As a proof of concept, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our bonding technology can be used in quantum computing applications.