Structure and Giant Magnetoresistance of Electrodeposited Co/Cu Multilayers Prepared by Two-Pulse (G/P) and Three-Pulse (G/P/G) Plating
N. Rajasekaran, L. Pog\'any, \'A. R\'ev\'esz, B.G. T\'oth, S. Mohan,, L. P\'eter, I. Bakonyi

TL;DR
This study compares two electrodeposition methods for Co/Cu multilayers, revealing that the three-pulse G/P/G technique produces better GMR at low Cu thicknesses and affects surface roughness and composition.
Contribution
It introduces and evaluates a novel G/P/G pulse deposition method for Co/Cu multilayers, enhancing GMR performance at low Cu thicknesses.
Findings
G/P/G multilayers exhibit GMR at lower Cu thicknesses than G/P.
Surface roughness and structural quality differ between methods.
Increased Cu content in magnetic layers influences superparamagnetic regions.
Abstract
The giant magnetoresistance (GMR) was investigated for electrodeposited Co/Cu multilayers. In order to better understand the formation of individual layers and their influence on GMR, multilayers produced by two different deposition strategies were compared. One series of Co(2 nm)/Cu(tCu) multilayers with tCu ranging from 0.5 nm to 6 nm was produced with the conventional two-pulse plating by using a galvanostatic/potentiostatic (G/P) pulse combination for the magnetic/non-magnetic layer deposition, respectively, whereby the Cu layer deposition was carried out at the electrochemically optimized potential. Another Co(2 nm)/Cu(tCu) multilayer series with the same tCu range was prepared with the help of a G/P/G pulse combination. In this latter case, first a bilayer of Co(2 nm)/Cu(6 nm) was deposited in each cycle as in the G/P mode after which a third G pulse was applied with a small…
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