Heat spreader with parallel microchannel configurations employing nanofluids for near active cooling of MEMS

TL;DR

This study investigates a novel parallel microchannel cooling system with nanofluids for near active cooling of microprocessors, combining experimental and numerical methods to optimize thermal management.

Contribution

It introduces a specific microchannel configuration and employs nanofluids with dual modeling approaches, demonstrating improved uniformity and temperature reduction in microelectronic cooling.

Findings

Z configuration with nanofluids offers optimal uniform cooling.

DPM modeling accurately predicts experimental results.

Proposed Figure of Merit effectively evaluates thermal performance.

Abstract

While parallel microchannel based cooling systems have been around for quite a period of time, employing the same and incorporating them for near active cooling of microelectronic devices is yet to be implemented and the implications of the same on thermal mitigation to be understood. The present article focusses on a specific design of the PMCS such that it can be implemented at ease on the heat spreader of a modern microprocessor to obtain near active cooling. Extensive experimental and numerical studies have been carried out to comprehend the same and three different flow configurations of PMCS have been adopted for the present investigations. Additional to focussing on the thermofluidics due to flow configuration, nanofluids have also been employed to achieve the desired essentials of mitigation of overshoot temperatures and improving uniformity of cooling. Two modelling methods, Discrete Phase Modelling and Effective Property Modelling have been employed for numerical study to model nanofluids as working fluid in micro flow paths and the DPM predictions have been observed to match accurately with experiments. To quantify the thermal performance of PMCS, an appropriate Figure of Merit has been proposed. From the FoM It has been perceived that the Z configuration employing nanofluid is the best suitable solutions for uniform thermal loads to achieve uniform cooling as well as reducing maximum temperature produced with in the device. The present results are very promising and viable approach for futuristic thermal mitigation of microprocessor systems.