# Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes

## TL;DR

This paper develops a kinetic model to analyze the stability of electrodeposition at solid-solid interfaces, revealing two regimes of stability and providing guidelines for designing stable metal anodes.

## Contribution

It introduces a new density-driven stability mechanism and generalizes conditions for stable electrodeposition considering stresses and surface tension.

## Key findings

- Identifies pressure-driven and density-driven stability regimes.
- Shows inorganic solids and solid polymers generally lack stability.
- Provides design guidelines for stable electrodeposition.

## Abstract

We generalize the conditions for stable electrodeposition at isotropic solid-solid interfaces using a kinetic model which incorporates the effects of stresses and surface tension at the interface. We develop a stability diagram that shows two regimes of stability: previously known pressure-driven mechanism and a new density-driven stability mechanism that is governed by the relative density of metal in the two phases. We show that inorganic solids and solid polymers generally do not lead to stable electrodeposition, and provide design guidelines for achieving stable electrodeposition.