# Compressive mechanical response of graphene foams and their thermal   resistance with copper interfaces

**Authors:** Wonjun Park, Xiangyu Li, Nirajan Mandal, Xiulin Ruan, and Yong P. Chen

arXiv: 1702.07816 · 2017-03-14

## TL;DR

This study investigates the compressive mechanical properties and thermal resistance of graphene foams with varying densities, revealing power-law relationships and the impact of density on energy absorption and thermal interface resistance.

## Contribution

It provides new insights into how the density of graphene foams influences their mechanical response and thermal interface resistance with copper, using CVD-prepared samples.

## Key findings

- Young's modulus and compressive strength follow power-law dependence on density.
- Maximum energy absorption efficiency exceeds 0.39 for all GFs.
- Thermal resistance increases with higher foam density.

## Abstract

We report compressive mechanical response of graphene foams (GFs) and the thermal resistance ($R_{TIM}$) between copper (Cu) and GFs, where GFs were prepared by the chemical vapor deposition (CVD) method. We observe that Young's modulus ($E_{GF}$) and compressive strength ($\sigma_{GF}$) of GFs have a power law dependence on increasing density ($\rho_{GF}$) of GFs. The maximum efficiency of absorbed energy ($\eta_{max}$) for all GFs during the compression is larger than ~0.39. We also find that a GF with a higher $\rho_{GF}$ shows a larger $\eta_{max}$. In addition, we observe that the measured $R_{TIM}$ of Cu/GFs at room temperature with a contact pressure of 0.25 MP applied increases from ~50 to ~90 $mm^2K/W$ when $\rho_{GF}$ increases from 4.7 to 31.9 $mg/cm^3$.

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Source: https://tomesphere.com/paper/1702.07816