# High-modulation-efficiency InGaAsP/Si hybrid MOS optical modulator with Mach-Zehnder interferometer

## TL;DR

This paper presents an InGaAsP/Si hybrid MOS optical modulator with a Mach-Zehnder interferometer that achieves significantly higher phase modulation efficiency than traditional Si modulators, enabling low-power, high-speed optical interconnects.

## Contribution

The paper introduces a novel InGaAsP/Si hybrid MOS optical modulator with direct wafer bonding that significantly improves phase modulation efficiency on silicon photonics platforms.

## Key findings

- Phase modulation efficiency of 0.047 Vcm, five times higher than Si MOS modulators.
- Electron accumulation at the InGaAsP MOS interface enhances refractive index change.
- Demonstrates a compatible, efficient modulation scheme for silicon photonics.

## Abstract

A high-modulation-efficiency optical modulator integrated on silicon (Si) is a key enabler for low-power and high-capacity optical interconnects. However, Si-based optical modulators suffer from low phase modulation efficiency owing to the weak plasma dispersion effect in Si. Therefore, it is essential to find a novel modulation scheme that is compatible with a Si photonics platform. Here, we demonstrate an InGaAsP/Si hybrid metal-oxide-semiconductor (MOS) optical modulator with a Mach-Zehnder interferometer (MZI) formed by direct wafer bonding with an Al2O3 bonding interface. Electron accumulation at the InGaAsP MOS interface enables the extraction of the electron-induced refractive index change in InGaAsP, which is significantly greater than that in Si. The presented modulator exhibits a phase modulation efficiency of 0.047 Vcm, which is approximately 5 times higher than that of Si MOS optical modulators. This approach provides a new efficient scheme of phase modulation on a Si photonics platform for low-power, high-speed, and high-density optical links.

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Source: https://tomesphere.com/paper/1702.02245