Cooling Codes: Thermal-Management Coding for High-Performance Interconnects
Yeow Meng Chee, Tuvi Etzion, Han Mao Kiah, Alexander Vardy

TL;DR
This paper introduces innovative coding schemes called cooling codes that directly manage the thermal profile of high-performance interconnects by controlling the hottest wires, reducing peak temperature and power consumption while enabling error correction.
Contribution
The paper presents the first coding schemes that simultaneously control peak temperature, reduce average power, and support error correction for high-performance interconnects.
Findings
Cooling codes effectively lower peak temperature of hottest wires.
The minimum number of wires needed is n = k + t + 1 for cooling t hottest wires.
Proposed schemes are practical with low computational overhead.
Abstract
High temperatures have dramatic negative effects on interconnect performance and, hence, numerous techniques have been proposed to reduce the power consumption of on-chip buses. However, existing methods fall short of fully addressing the thermal challenges posed by high-performance interconnects. In this paper, we introduce new efficient coding schemes that make it possible to directly control the peak temperature of a bus by effectively cooling its hottest wires. This is achieved by avoiding state transitions on the hottest wires for as long as necessary until their temperature drops off. We also reduce the average power consumption by making sure that the total number of state transitions on all the wires is below a prescribed threshold. We show how each of these two features can be coded for separately or, alternatively, how both can be achieved at the same time. In addition,…
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Taxonomy
TopicsLow-power high-performance VLSI design · Interconnection Networks and Systems · Parallel Computing and Optimization Techniques
