Temperature Dependence of the Yield Strength of Aluminum Thin Films: Multiscale Modeling Approach

TL;DR

This paper investigates how temperature affects the yield strength of aluminum thin films by integrating molecular dynamics, 3D discrete dislocation dynamics, and experimental data, revealing an 18% decrease from 100 K to 600 K.

Contribution

It introduces a multiscale modeling approach that incorporates temperature-dependent DDD parameters for accurate deformation simulation of aluminum thin films.

Findings

Yield strength decreases by 18% from 100 K to 600 K.

Temperature dependence of DDD parameters is characterized using MD, 3D DDD, and experiments.

The approach improves understanding of deformation behavior at elevated temperatures.

Abstract

Modeling deformation at elevated temperatures using discrete dislocation dynamics (DDD) is a recent area of high interest. However, the literature dedicated to this subject fails to address the variations of DDD parameters with temperature. This study aims to investigate the effect of temperature on the yield strength of aluminum thin films in two-dimensional DDD simulations. To this end, the temperature dependence of DDD parameters has been studied using molecular dynamics, three-dimensional DDD simulations, and the existing experimental results. Based on these calculations, we observed 18% decrease in the yield strength when temperature was increased from 100 K to 600 K.