# Image sensor array based on graphene-CMOS integration

**Authors:** Stijn Goossens, Gabriele Navickaite, Carles Monasterio, Shuchi Gupta,, Juan Jos\'e Piqueras, Ra\'ul P\'erez, Gregory Burwell, Ivan Nikitskiy, Tania, Lasanta, Teresa Gal\'an, Eric Puma, Alba Centeno, Amaia Pesquera, Amaia, Zurutuza, Gerasimos Konstantatos, Frank Koppens

arXiv: 1701.03242 · 2017-06-28

## TL;DR

This paper presents the first monolithic integration of graphene with CMOS technology, enabling high-resolution, multi-spectral image sensors sensitive to UV, visible, and infrared light, advancing next-generation microelectronics and imaging systems.

## Contribution

It demonstrates for the first time the monolithic integration of graphene with CMOS, creating a high-resolution, multi-spectral image sensor operating across UV to infrared.

## Key findings

- Successful monolithic graphene-CMOS integration achieved.
- High-resolution image sensor demonstrated.
- Sensor operates across UV, visible, and infrared spectra.

## Abstract

Integrated circuits based on CMOS (complementary metal-oxide semiconductors) are at the heart of the technological revolution of the past 40 years, as these have enabled compact and low cost micro-electronic circuits and imaging systems. However, the diversification of this platform into applications other than microcircuits and visible light cameras has been impeded by the difficulty to combine other semiconductors than silicon with CMOS. Here, we show for the first time the monolithic integration of a CMOS integrated circuit with graphene, operating as a high mobility phototransistor. We demonstrate a high-resolution image sensor and operate it as a digital camera that is sensitive to UV, visible and infrared light. The demonstrated graphene-CMOS integration is pivotal for incorporating 2d materials into the next generation microelectronics, sensor arrays, low-power integrated photonics and CMOS imaging systems covering visible, infrared and even terahertz frequencies.. The demonstrated graphene-CMOS integration is pivotal for incorporating 2d materials into the next generation microelectronics, sensor arrays, low-power integrated photonics and CMOS imaging systems covering visible, infrared and even terahertz frequencies.

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Source: https://tomesphere.com/paper/1701.03242