Annealing shallow Si/SiO$_2$ interface traps in electron-beam irradiated high-mobility metal-oxide-silicon transistors
Jin-Sung Kim, Alexei M. Tyryshkin, Stephen A. Lyon

TL;DR
This study demonstrates that forming gas annealing effectively removes shallow interface traps created by electron-beam lithography in high-mobility MOSFETs, restoring their mobility close to unexposed levels and reducing trap densities.
Contribution
It provides experimental evidence that forming gas anneal can mitigate e-beam induced shallow traps at the Si/SiO$_2$ interface in MOSFETs, improving device performance.
Findings
Forming gas anneal recovers mobility in e-beam irradiated MOSFETs.
ESR measurements show trap densities are nearly eliminated after annealing.
Transport data fit to a percolation model aligns with ESR trap measurements.
Abstract
Electron-beam (e-beam) lithography is commonly used in fabricating metal-oxide-silicon (MOS) quantum devices but creates defects at the Si/SiO interface. Here we show that a forming gas anneal is effective at removing shallow defects ( 4 meV below the conduction band edge) created by an e-beam exposure by measuring the density of shallow electron traps in two sets of high-mobility MOS field-effect transistors (MOSFETs). One set was irradiated with an electron-beam (10 keV, 40 C/cm) and was subsequently annealed in forming gas while the other set remained unexposed. Low temperature (335 mK) transport measurements indicate that the forming gas anneal recovers the e-beam exposed sample's peak mobility (14,000 cm/Vs) to within a factor of two of the unexposed sample's mobility (23,000 cm/Vs). Using electron spin resonance (ESR) to measure the density of shallow…
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